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Daim Ntawv Thov Scenario Ntawm 24-Segment Curve Industrial Process Controllers

Dec 23, 2025 Tso lus

I. Kev ua cov khoom siv thiab kev kho cua sov (Core High-Frequency Scenario)

 

Tus nqi tseem ceeb: Npog tag nrho cov txheej txheem ntawm cua sov → kev txuag hluav taws xob → txias, txhawb cov pa roj carbon muaj peev xwm / nitrogen muaj peev xwm txuas tswj, thiab xyuas kom muaj kev ruaj ntseg ntawm cov qauv metallographic thiab kev ua tau zoo sib xws.

 

  1. Hlau Thaum tshav kub kub kho: quenching, tempering, annealing, carburizing / nitrocarburizing. Lub 24- ntu nkhaus hloov mus rau ntau- theem kev txuag hluav taws xob thiab kev tswj xyuas cua sov, thiab koom tes nrog cov pa oxygen sojntsuam kom paub txog kev kaw-kho cov pa roj carbon ntau, txhim kho hardness thiab hnav tsis kam ntawm workpieces.
  2. Composite Khoom MouldingPrepreg curing, SMC / BMC molding. Precisely tswj cua sov tus nqi thiab multi-theem tshav kub preservation kom tsis txhob porosity, deformation thiab nyob rau hauv kev ntxhov siab concentration.
  3. Iav / Ceramic Fitting: Segmented kub tswj rau ntau- cheeb tsam kilns, yoog raws cov txheej txheem nkhaus ntawm melting, fining thiab annealing, txo qhov tawg thiab xim sib txawv, thiab txhim kho cov khoom tawm los.
  4. Hmoov metallurgy: Sintering tom qab nias. 24- ntu nkhaus paub qhov qis- qhov kub thiab txias tshem tawm, nruab nrab- kub ua ntej- sintering, kub-kub sintering thiab qeeb txias, tswj cov nplej loj thiab ntom.

 

II. Electronics thiab Semiconductor Manufacturing (High-Qhov Kev Txiav Txim Siab)

 

Tus nqi tseem ceeb: Cov kauj ruam tswj qhov kub thiab txias micro- hloov pauv hloov pauv, ua tau raws li qhov yuav tsum tau ua nruj me ntsis ntawm micron- cov txheej txheem rau qib kev ruaj ntseg.

 

  1. Cov txheej txheem wafer / ntim: Segmented kub tswj ntawm diffusion furnaces, PECVD cov cuab yeej thiab oxidation furnaces, adapting rau meej kub tswj cov kev cai ntawm doping thiab nyias - zaj duab xis deposition, thiab xyuas kom meej zaj duab xis thickness thiab uniformity.
  2. Lithium Battery Production: Electrode daim ntawv ci, nqus kom qhuav ua ntej ua kua. Lub 24- ntu nkhaus ua tiav cov cua kub thiab qhov kub thiab txias dehumidification, zam kev puas tsuaj rau cov ntaub ntawv thiab ua kom muaj kev ua haujlwm ntawm electrochemical.
  3. PCB kev tsim khoom: Kub cua leveling, solder mask curing. Segmented kub tswj adapts rau lub thermal yam ntxwv ntawm txawv substrates thiab inks, txhim kho ncoo flatness thiab adhesion.

 

III. Chemical and Pharmaceutical Industries (Ua raws cai thiab Batch Consistency Scenarios)

 

Tus nqi tseem ceeb: Segmented program tswj xyuas cov tshuaj tiv thaiv tus nqi thiab cov khoom purity, ua tau raws li GMP cov cai rau batch reproducibility thiab cov ntaub ntawv traceability.

 

  1. Fine Chemical Synthesis: Polymerization, catalysis, esterification cov tshuaj tiv thaiv. Lub 24-nqaj nkhaus tswj cov kauj ruam hloov ntawm qhov kub thiab txias, suppressing sab cuam tshuam thiab txhim kho cov txiaj ntsig.
  2. Pharmaceutical Freeze-Kev ziab: Peb-theem nkhaus tswj lub khov tshuab ziab khaub ncaws (ua ntej- khov → sublimation → desorption drying), ua kom paub tseeb qhov ntsuas kub thiab lub tshuab nqus tsev sib txuas, thiab xyuas kom muaj kev ua yeeb yam thiab qhov tsos.
  3. Cov txheej txheem fermentation: Segmented kev tswj ntawm kub thiab yaj oxygen rau microbial kab lis kev cai, yoog raws qhov sib txawv ntawm cov kev xav tau ntawm cov kab mob hauv theem lag luam, theem logarithmic thiab theem nyob ruaj khov, thiab nce fermentation titer.
  4. Txheej / Adhesive Curing: Segmented temperature controls adapts cross -linking reactions, controlling curing rate and film performance, and zam pinholes and cracking.

 

IV. Tshiab Zog thiab Khoom Siv R & D (R & D rau Kev Hloov Pauv Ntau Lawm)

 

Tus nqi tseem ceeb: Txhawb ntau- qauv khaws cia thiab kev hloov pauv, hloov mus rau cov txheej txheem tsiv teb tsaws los ntawm cov khoom R&D mus rau kev tsav tsheb- nplai thiab ntau lawm.

 

  1. Roj teeb khoom Sintering: Multi-theem cua sov thiab kev txuag hluav taws xob ntawm ternary/LFP cathodes thiab silicon-carbon anodes, tswj cov qauv siv lead ua thiab cov khoom siv hluav taws xob sib xws.
  2. PV Module Lamination: Kub-lub sij hawm nkhaus tswj ntawm EVA zaj duab xis hla- txuas, hloov mus rau cov txheej txheem lamination sib txawv, thiab txhim kho module durability thiab lub zog tso zis.
  3. Laboratory/pilot-Nqe khoom: Cov txheej txheem tsim qauv, txhawb kev khaws cia ntawm 9–15 nkhaus, hloov mus rau ntau- qauv hloov pauv thiab qhov ntsuas qhov ua kom zoo, thiab txo qis R&D cycles.

 

V. Lwm yam kev lag luam (Kev siv txuas ntxiv)

 

  1. Lub tshuab nqus tsev vacuum / Autoclaves: Segmented kub / siab tswj nyob rau hauv siab -kub thiab siab - siab ib puag ncig, hloov mus rau cov ntaub ntawv kev ua tau zoo thiab cov txheej txheem tshwj xeeb, thiab ua kom muaj kev ruaj ntseg thiab cov ntaub ntawv traceability.
  2. Ntim thiab Lamination: Segmented kub tswj cov cua sov- txheej txheem sealing thiab lamination, yoog raws cov yam ntxwv thermal ntawm cov substrates sib txawv (PE / PP / aluminium ntawv ci), thiab txhim kho sealing zog thiab lamination firmness.
  3. Kev lag luam zaub mov thiab dej haus: Cov kaus poom zaub mov kom tsis muaj menyuam, cov khoom noj siv mis pasteurization. Lub 24-ntu nkhaus hloov mus rau cov txheej txheem thermal sterilization ntawm cua sov → qhov kub thiab txias → txias, ua kom cov zaub mov muaj kev nyab xeeb thiab txee lub neej.
  4. Roj hmab thiab yas ua: Segmented kub tswj ntawm chim nyob rau hauv extrusion, txhaj tshuaj molding thiab tshuab moulding txheej txheem, adapting rau lub melting yam ntxwv ntawm txawv resins, thiab txo cov plasticizing tsis xws luag thiab cov khoom flaws.